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        Bardri:
                  It is not the moisture on the component but in the
component that when heated expands and pops the component carrier cover
( Pop corning ).  Once the cover is open , the chip is exposed to the
ambient and does not last long. After it goes through the reflow oven
(board assembly), the risk is not longer there.
        Regards,
        Ramon

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Badri
Sent: Friday, August 11, 2006 12:01 AM
To: [log in to unmask]
Subject: [TN] dross generation

Dear All,

May be a basic question. Seeking everyones help in understanding.
Moisture sensitive devices are baked before reflow. why and what will be
the impact.
After board assembly what is the impact of moisture on the components.
Is there a standard available that specifies the right method of baking.

Advance thanx for the help you are rendering me.

Thanx
Badri

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