Hello fellow Technetters, Would like some advise from the experts out there. We have always assembled pcb with minimal solder balls that usually gets washed away in the cleaning process, hence not creating any major problems. However, recently we have been getting involve with more complex boards that has alot of 1mm and .8mm low profile bga's. The problem that we are noticing is that the solder balls that never was a problem before are now getting stuck under the bga's, sometimes creating shorts. I am not sure if we can eliminate solder balls completely but would like to know how the experts are resolving a problem of this sort. Thanks in advance for your input. Regards, Carl Beharry Ectronics, Inc. 855 Industrial Hwy Cinnaminson, NJ 08077 Phone : (856) 829-7161 Fax : (856) 829-6950 Email : [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------