Hi,

  Recently, I met a customer complaint for Immersion Ag boards.  Immersion Ag  boards in assembly side weren't applied solder on ICT(in circuit test) pads.  After assembly, Ag surface discoloration problem and ICT failure defect were found in those pads.  Those pad were still solderable.  ICT was OK after soldering.  Does anyone have similar experience?  How can I solve this problem?  Does it need to suggest pre-solder before ICT?  It's chronic or excursion issue for immersion Ag surface finish?

  Best regards

  Leo

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