This is in reply to Dennis Fritz's question reqarding 6016. I have always been puzzled by this document. I know it's intentions, however it does require 5 Thermal Stress Cycles at 500F, Except where prohibited by the number of Stress Cycles and Temp for the entire board. So, any micro via on a board with through holes will receive only one Thermal Stress Test Cycle at 550F. There is a requirement that there can be only 50% contact between the plating and the target land area, that is pretty controversial. There is an allwed 180 degree breakout allowed for misregistration to the target contact area that would be a nightmare to evaluate. There is a set of criteria for blind microvias <15 um in 6012 that tracks with the copper plating in 6016 - so that is good. We see many, many drawings that have microvias that do not invoke 6016. Does the industry believe IPC-6016 is needed or are the attributes adequately addressed in IPC-6012??? Susan Hott Robisan Lab --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------