IPC-TM-650 procedures are available to the public (no charge) on the IPC website. Don vischulis -----Original Message----- >From: "Chezhian, Krishnan (Radhakrishnan)" <[log in to unmask]> >Sent: Jul 25, 2006 1:05 AM >To: [log in to unmask] >Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06 > >Hi Huynh, > >You could refer to the IPC Specs. TM-650 Section 2.4.24C - Glass >Transition Temperature & Z-Axis Thermal Expansion by TMA & Section >2.4.24.1 - Time To Delamination (TMA Method) & Section 2.4.25C - Glass >Transition Temperature & Cure Factor By DSC. These are IPC specs. so >cannot be forwarded, need license.... > >Thanks & Best Regards, >Krishnan C >SANMINA-SCI > > >-----Original Message----- >From: Huynh Thanh Nhan [mailto:[log in to unmask]] >Sent: Tuesday, July 25, 2006 1:41 PM >To: TechNet E-Mail Forum; Chezhian, Krishnan (Radhakrishnan) >Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06 > >Dear Mr. Krishnan, > >Could you send any document or web site about >"DSC test to check the Tg of the material to see if it >fully cured" and "TMA test to see the T260C". > >Thanks and best regards, >Nhan > >----- Original Message ----- >From: "Chezhian, Krishnan (Radhakrishnan)" ><[log in to unmask]> >To: <[log in to unmask]> >Sent: Tuesday, July 25, 2006 12:19 PM >Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06 > > >Hi Suresh, > >The reason for delamination could be due to various causes. From the >description given below it is not clear whether you are able to see the >delamination or "popcorn" effect from the outer layers after your >outer-layer etch process or the delamination only occurs after the >boards have been subjected to a thermal excursion like HASL, thermal >shock, IR reflow or wave-solder process. >If the delamination is occurring over the copper surface on the >inner-layers, it is most probably the adhesion between the prepregs & >oxide-coated copper surface is poor. This could be due to poor or >insufficient oxide coating or the lamination parameters are not fine >tuned, so the material is not fully cured. Since you are saying both the >Isola & Nelco materials exhibit this phenomena, then it is most unlikely >to be a material issue. >You could run a DSC test to check the Tg of the material to see if it >fully cured or perform a TMA test to see the T260C, time to >delamination. If these numbers appear to be quite low than the vendors >spec. then you have an issue with the lamination processing parameters. >If you are seeing the delamination after the boards have been subjected >to a thermal excursion then there are other factors that would come to >play, like shelf life & storage conditions of the boards, how long the >boards have been kept & whether any baking was done prior to subjecting >to any thermal excursion, moisture absorption due to the hygroscopic >nature of the FR-4 material. Or if the boards have been subjected to a >Lead Free process & the laminate material used is not compatible to this >process etc., >Pls provide more details as to the exact occurrence of the delamination >& we may be able to share more info on this........ > >Thanks & Best Regards, >Krishnan C >SANMINA-SCI > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of T Suresh Babu >Sent: Tuesday, July 25, 2006 11:53 AM >To: [log in to unmask] >Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06 > >Dear Friends, >I am new member for Technet.We are experiencing the delamination in the >multilayer ten layer and above.We us Isola and Nelco prepeg we are >experiencing this problem with both materials.The delamination over the >copper area on innerlayer.We use black oxide for the innerlayer and >vacuum >press for lamination. >Can any one share your experience. >Regards >Suresh > >----- Original Message ----- >From: "Tina Nerad" <[log in to unmask]> >To: <[log in to unmask]> >Sent: Tuesday, July 25, 2006 2:39 AM >Subject: [TN] IPC webcast - Electroplating Technologies - 7/27/06 > > >Electroplating technologies, including an overview of the plating >process and factors affecting plating distribution and throwing power, >are the topics in this webcast. Don't miss out on this opportunity to >learn everything you need to know about the electroplating process! > >Electroplating Technologies >July 27th, 2006, 10:00 a.m. - 11:00 .am. (CDT) > >To register for this webcast or for more information, visit: >http://www.ipc.org/calendar/2006/PWB_BasicWebcastSeries_0706/PWBFab_Webc >astSeries_706.htm > >Following this webcast, IPC is hosting an in-depth workshop covering >every aspect of the PCB Manufacturing Process: > >August 2, 2006, 8:00 a.m. - 4:30 p.m. >Bannockburn, IL >Instructor: Michael Carano >Electrochemicals, Inc. > >To register for this workshop or for more information, visit: >http://www.ipc.org/calendar/2006/AdvTroubleshooting_0806/Advtroubleshoti >ng_806.htm > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text >in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: >http://listserv.ipc.org/archives >Please visit IPC web site >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] >or >847-615-7100 ext.2815 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text >in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: >http://listserv.ipc.org/archives >Please visit IPC web site >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >ext.2815 >----------------------------------------------------- > >________________________________________________________________________ >_____ >Scanned by Sanmina-SCI eShield >________________________________________________________________________ >_____ > >CONFIDENTIALITY >This e-mail message and any attachments thereto, is intended only for >use by >the addressee(s) named herein and may contain legally privileged and/or >confidential information. 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