We have a PCBA assembly that requires very low/none ionic contamination due to high impedance circuitry. Normally we use a water soluble flux solder paste and wash the PCBAs. Our current vendor only uses Indium NC-SMQ92 no-clean solder paste. To met the following spec: Printed Circuit Assemblies shall meet cleanliness standards as per IPC-A-610 and IPC/EIA J-STD-001. Testing shall be in accordance with and meet the requirements of IPC/EIA J-STD-001 Paragraph 8.3.6 or 8.3.7. they want to use water and Kyzen XJN+ as a saponifier. Has anyone used this method of cleaning a no clean assembly? If so what was the result? Any other suggestions? Thank you. Best Regards, Michael Forrester Sr. Manufacturing Engineer LeCroy Corp --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------