Hi Gerry, Automotive electronics, particularly under-hood, are operating in some of the most severe environments for electronics. As such, designs that would be perfectly reliable in other operating conditions may fail prematurely in this environment. Thus, proper Design-for-Reliability (DfR) is more challenging for automotive applications than for applications like telecommunications or computers. And, of course, this has not been made easier with the forced change to lead-free solders—the automotive exemption is unfortunately an unrealistic illusion. There is no reason to avoid BGAs in automotive use, but the larger they get the more challenging DfR will be. Regards, Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904 E-mail: [log in to unmask], Website: www.engelmaier.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------