Good Mornin' John! I wish it were so, but after a search I came up with these links that describe planar array capacitors: http://www.syfer.com/category_docs/planar.pdf http://www.glenair.com/interconnects/filter/brochure.pdf -Steve Gregory- -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Wednesday, June 28, 2006 6:03 PM To: [log in to unmask] Subject: Re: [TN] Draft exemptions additions Actually I just noticed doesn't this description "planar array ceramic multilayer capacitors." Describe any SMT cap? John -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Wednesday, June 28, 2006 3:54 PM To: [log in to unmask] Subject: Re: [TN] Draft exemptions additions Um........it was Monday?? John -----Original Message----- From: Ahne Oosterhof [mailto:[log in to unmask]] Sent: Wednesday, June 28, 2006 2:20 PM To: 'TechNet E-Mail Forum'; 'John Burke' Subject: RE: [TN] Draft exemptions additions And what was the "technical" background reason for these exemptions? Most curious about that for numbers 23 and 24. Ahne. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Wednesday, 28 June, 2006 11:09 To: [log in to unmask] Subject: [TN] Draft exemptions additions Here is the draft of the exemptions list that was approved by the TAC on their meeting this week. It is draft so presumably not yet written in stone: John ANNEX In the Annex to Directive 2002/95/EC the following points 21 to 27 are added: "21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass. 22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems. 23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead-frames. 24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. 25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. 26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps. 27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers." --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------