I've been using Peters Paste #PP-2795 OR SD-2361, OR EQUIVALENT, for all via-in-pad designs and it works quite well. I also add the following statement on the FAB drawing. " SURFACE TO BE PLANAR PRIOR TO FINAL PLATING AND METALLIZATION. BOARDS MUST BE SUITABLE FOR VIA IN PAD TECHNOLOGY". I hope this helps. Scott Lefebvre -----Original Message----- From: Wayne Thayer [mailto:[log in to unmask]] Sent: Wednesday, June 21, 2006 1:09 PM Subject: Re: via-in-pad design Right. Just specify a non-conductive via fill process. Wayne Thayer >>> [log in to unmask] 6/21/2006 4:04 pm >>> Hi all, I have a PCB that uses a BRF6150 uBGA (0.5mm pitch) that I need to redesign. The current design uses very small blind and buried vias and the customer want to use through-all vias. The only way I can do this is by utilizing a via-in-pad method. Is that still a good option? maybe used with a via-fill goo? Thanks Ken _____ Saturn PCB Design Kenneth J. Wood CID 2737 Bishop Lane Deltona, Fl 32725 Phone: 407-340-2668 email: <mailto:[log in to unmask]> [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------