CAF-Conductive Anodic Filamentation (or Conductive Anodic Filament
growth) - An electrical short which occurs in PCBs when a conductive
filament forms in the laminate dielectric material between two adjacent
conductors under an electrical bias. CAF is a potentially dangerous
source of electrical failure in the PCB.  As PCB designs have increased
in density, with hole-to-hole spacings reduced to 25 mils or less, CAF
has become an everyday concern. [adapted from Erik J. Bergum, "CAF
Resistance of NON- DICY FR-4," PC FAB, 9/2002] 
  Ramon
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Wednesday, June 21, 2006 4:05 PM
To: [log in to unmask]
Subject: Re: [TN] Board material

Conductive Anodic Filament(CAF)growth can result in a CAF failure.
Contrary to popular opinion it is not the result of Mad Cow Disease.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Carroll
Sent: Wednesday, June 21, 2006 12:45 PM
To: [log in to unmask]
Subject: [TN] Board material

I'm unfamiliar with an acronym.  What is CAF material and what, if
anything, is special about it?

George Carroll
Process Engineer, EPIC Technologies, LLC 3000 Bill Garland Road Johnson
City, Tennessee 37604
(423) 461-2948
[log in to unmask]

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