Hi All

  I recently faced a new issues with lead-free BGA.
  We use Qualcomm ICs in our productions. Recently Qualcomm's PCN shows the BGA balls material change from SAC305 to SAC105.The melting point update to 227 degree.
  Could you please tell me how to assembly the new BGAs, I mean which alloy paster should be used, SAC305 or other special? Any treatment should be made to the reflow profile?
  By the way what is the advancement of SAC105 alloy?

Thanks in advance.

Don Well
Huawei Technologies Co,. Ltd


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