Hi Roland We have some data and I will try to dig out the relevant files to send you. In essence we found that HASL offers the least favorable SIR values lead or lead-free. We are presently finishing a major study of lead-free ENIG, ImSn and ImAg so might have some better info/data-sets by the end of June. As to your concerns about OSP, from what you describe I would be more worried about solderability if the OSP is compromised. Give me a few days to pull out the info...unless you need urgently? Graham Naisbitt On 7 Jun 2006, at 16:50, Roland Jaquet wrote: > Dear Technetters, > > Earlier today I sent an email that for some reason got erased. I > apologize. > > I am wondering if there is some knowledge regarding the surface > electrical > insulation / resistance depending on the type of Surface Finishes > such as > for the bare PCBs as below: > > #1 Electroless Nickel Immersion Gold > #2 Immersion Tin > #3 HAL Lead free > Organic Solderability/Surface Preservative > Electroplated nickel & gold > Electroless nickel immersion thick gold > Immersion Silver > Electroless Nickel & Palladium, Immersion Gold > Hot air solder leveling > Electroless Thick Gold > SAC > (any finishes I am missing here?) > > For instance, I am wondering what could be the resistance of an OSP > finish > if the contact is such as a feather and flat, versus conical point > digging > in? > > Anyone met this kind of problem yet? > > In our case, we are considering contact less Electrical Test and we > worry > about the different issues we could get in with such a process! > > Any suggestion? > > Thank you > Best Regards > Roland > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------