Dear Technetters, Earlier today I sent an email that for some reason got erased. I apologize. I am wondering if there is some knowledge regarding the surface electrical insulation / resistance depending on the type of Surface Finishes such as for the bare PCBs as below: #1 Electroless Nickel Immersion Gold #2 Immersion Tin #3 HAL Lead free Organic Solderability/Surface Preservative Electroplated nickel & gold Electroless nickel immersion thick gold Immersion Silver Electroless Nickel & Palladium, Immersion Gold Hot air solder leveling Electroless Thick Gold SAC (any finishes I am missing here?) For instance, I am wondering what could be the resistance of an OSP finish if the contact is such as a feather and flat, versus conical point digging in? Anyone met this kind of problem yet? In our case, we are considering contact less Electrical Test and we worry about the different issues we could get in with such a process! Any suggestion? Thank you Best Regards Roland --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------