Hi Reuven, You write: > Its depend if the failure is inside the capacitor or a solder joint > failure. > Crack / short / open (inside the caps layers) in such small size of SMT > caps (for pacemakers), supposed to be a manufacturing failure. > Solder joint failure - Solder crack, thumb stone, de wetting, shift, etc is > a PCB design or process failure. > Not necessarily. CC cracking is often caused by the soldering process or the solder itself as a result of thermal shock on cooling and/or too large a solder fillet. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------