Barry: In regards to plating. Thieving: Features placed on the outerlayer of the board to balance the plateable surface area, producing uniform current distribution during electroplating. Thus providing a consistent plating thickness across the board and in the holes. Regards Michael Barmuta Staff Engineer Fluke Corp. Everett WA 425-446-6076 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos Sent: Tuesday, May 02, 2006 2:22 PM To: [log in to unmask] Subject: [TN] Thieving Good day T'Netters. Am looking for a definition of Thieving when applied to PCB fabs. Thank you in advance Barry --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- This message (including any attachments) contains confidential and/or proprietary information intended only for the addressee. Any unauthorized disclosure, copying, distribution or reliance on the contents of this information is strictly prohibited and may constitute a violation of law. If you are not the intended recipient, please notify the sender immediately by responding to this e-mail, and delete the message from your system. If you have any questions about this e-mail please notify the sender immediately. Ce message (ainsi que les 'eventuelles pi`eces jointes) est exclusivement adress'e au destinataire et contient des informations confidentielles. La copie, la communication ou la distribution du contenu de ce message sans l'accord pr'ealable de l'exp'editeur sont strictement interdites et peuvent constituer un d'elit. Si vous n'^etes pas le destinataire de ce message, merci de le d'etruire et d'avertir l'exp'editeur. Si vous avez des questions se rapportant `a ce courrier 'electronique, merci de bien vouloir notifier l'exp'editeur imm'ediatement. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------