Thanks Happy! A comprehensive answer, pretty much the way I used to see it. But I have another one: what kind of proof should I ask that the boards are able to withstand all this? What tests will be done by the manufacturer and what test results do I have to ask for? I mean, a manufacturer might pretend their boards comply, we receive them, and they fail. The easy thing is to say that I disqualify them. But due to these bad boards I might loose business and get bad publicity, so it is not that simple. So what should it be, T288 delam, as many graphs as the specified number of cycles, after each thermal cycle simulation through a solder float at the specified peak temperatures? That would request many test coupons though. Regards, Ioan -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Happy Holden Sent: Friday, May 26, 2006 12:33 PM To: [log in to unmask] Subject: Re: [TN] Rohs Weeeeeee board material Hi, That's why we tell all our clients now to adjust their board blueprint MFG NOTES with the following additional statements: 1. That the finished multilayer must withstand (A)The LF assembly process description including a. Peak Temp b. Time at Peak Temp c Total time above 250C on heating and cooling d. Number of Cycles of a.+b.+c. and (B) If repair and rework is going to be performed and what those Time & Temp will be. 2. That the finished multilayer must withstand 3 cycles of a 288C-10 sec. solder-dip without delamination or hole cracking, measures and checked in (a) Ground-plane area AND (b) In the BGA area before the board is shipped. Happy Holden Asian Pacific Materials "Stadem, Richard D." <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 05/26/2006 11:56 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Stadem, Richard D." <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Rohs Weeeeeee board material That is the purpose of a thorough process/procedures audit done periodically to ensure the material received is going to be good. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Friday, May 26, 2006 10:50 AM To: [log in to unmask] Subject: Re: [TN] Rohs Weeeeeee board material Hi, I guess we have a good idea now of the difficulties in specifying and manufacturing lead-free capable PCBs. The next question that comes to my mind is how are we going to assess if the PCBs that are well speced are what we expect? I mean, the spec can be OK, whether perfect IPC-4010 slash sheets are developed, or STII is implanted. But the manufacturer might still use expired prepregs, they can have lamination problems, and so on. What tests shall a contract manufacturer or OEM with no in-house testing capability impose, in order to have the confidence that they receive what they specified? Thanks, Ioan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------