Hi Richard I wish I had an expert opinion on this one. The rigid board group is trying to identify what tests are being used by people who buy boards to determine if the boards will withstand the elevated temp of Lead-Free. So far the consensus has indicated a new test needs to be developed that involves multiple passes through IR reflow. What the parameters would be is still up for grabs. The Thermal Stress test, as far as I am aware of, has been able to weed out infant mortality of "regular" boards used in current surface mount and wave soldering processes. All bets are off when it comes to the extended times and temperatures required to accomodate all of the combinations of leaded and lead free assembly processing. Any and all recommendations would be appreciated as the 6012 group states this investigation as to what is needed. Susan Hott Robisan Lab --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------