Hi Happy
I have a question regarding the step below

2. An initial qualifying order is built and some boards are sacrificed to
the 3X 288C-10 sec solder dip and well as simple coupons on the panel
border.  All are cross-sectioned and sent with the Qual Order.



Do you actually "dip" the samples in solder or do you perform IPC-TM-650,
2.6.8 which is Thermal Stress and is floating the sample on solder for the same
time and at the same temp,

Susan Hott
Robisan Lab

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