Hi Happy I have a question regarding the step below 2. An initial qualifying order is built and some boards are sacrificed to the 3X 288C-10 sec solder dip and well as simple coupons on the panel border. All are cross-sectioned and sent with the Qual Order. Do you actually "dip" the samples in solder or do you perform IPC-TM-650, 2.6.8 which is Thermal Stress and is floating the sample on solder for the same time and at the same temp, Susan Hott Robisan Lab --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------