Can I / should I expect the same level of soldermask adhesion over vias as
over the copper plane or laminate?  I have PCBs that have poor adhesion of
soldermask over the via pads, but acceptable everywhere else.  Many vias are
now bare copper, and the vias that are covered easily fail any tape adhesion
test.

How should I specify adhesion requirements on a drawing?  IPC-SM-840?

Thanks,



Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.




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