Can I / should I expect the same level of soldermask adhesion over vias as over the copper plane or laminate? I have PCBs that have poor adhesion of soldermask over the via pads, but acceptable everywhere else. Many vias are now bare copper, and the vias that are covered easily fail any tape adhesion test. How should I specify adhesion requirements on a drawing? IPC-SM-840? Thanks, Kevin Glidden Manufacturing Engineer Luminescent Systems Inc. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------