I believe one of the key issues in assembling ENIG parts is that the inter-metallic formed is a Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwell at peak temperature. The right re-flow temperature profile is a must. The recommendation of ENIG assembly is 220 C for 20 seconds. Some of the failures with ENIG may be attributed to colder assembly temperatures. The transition to Pb-Free should favor ENIG as the assembly temperature for Pb-Free is going to be higher and the Ni/Sn inter-metallic will always be formed successfully. Best regards George Milad [log in to unmask] National Accounts Manager for Technology Uyemura International Corporation Technical Center 240 Town LIne Rd Southington CT 06489 (516) 901 3874 (mobile) (860) 793-4011 (office) (860) 793-4020 (fax) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------