Popcorning and delamination of plastic IC packages in reflow assembly is covered by an IPC/JEDEC standard, IPC/JEDEC J-STD-020C, "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices". This standard is available free on JEDEC's website. http://www.jedec.org/download/search/jstd020c.pdf Daniel Blass Process Research Engineer Area Array Consortium Surface Mount Technology Lab Universal Instruments Corporation http://www.uic.com/wcms/WCMS2.nsf/index/Global_Svc_Support_31.html --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------