Hi, That's why we tell all our clients now to adjust their board blueprint MFG NOTES with the following additional statements: 1. That the finished multilayer must withstand (A)The LF assembly process description including a. Peak Temp b. Time at Peak Temp c Total time above 250C on heating and cooling d. Number of Cycles of a.+b.+c. and (B) If repair and rework is going to be performed and what those Time & Temp will be. 2. That the finished multilayer must withstand 3 cycles of a 288C-10 sec. solder-dip without delamination or hole cracking, measures and checked in (a) Ground-plane area AND (b) In the BGA area before the board is shipped. Happy Holden Asian Pacific Materials "Stadem, Richard D." <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 05/26/2006 11:56 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Stadem, Richard D." <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Rohs Weeeeeee board material That is the purpose of a thorough process/procedures audit done periodically to ensure the material received is going to be good. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Friday, May 26, 2006 10:50 AM To: [log in to unmask] Subject: Re: [TN] Rohs Weeeeeee board material Hi, I guess we have a good idea now of the difficulties in specifying and manufacturing lead-free capable PCBs. The next question that comes to my mind is how are we going to assess if the PCBs that are well speced are what we expect? I mean, the spec can be OK, whether perfect IPC-4010 slash sheets are developed, or STII is implanted. But the manufacturer might still use expired prepregs, they can have lamination problems, and so on. What tests shall a contract manufacturer or OEM with no in-house testing capability impose, in order to have the confidence that they receive what they specified? Thanks, Ioan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------