Hello Technet,

We're seeing a recurring problem of a cracked ceramic IC, assembled on a
through-hole PWB.  The component is an 8-pin DIP, T.I. P/N 5962-9452601QPA .
The crack is located below the lead frame and radiates all the way around
the device.  Has anyone experienced this before?

Please respond directly to me, as I cannot receive e-mails from Technet.

Thanks in advance,

Jim Marsico
Senior Engineer
Production Engineering
EDO Corporation
[log in to unmask] <mailto:[log in to unmask]>
631-630-5079

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