Hello Technet, We're seeing a recurring problem of a cracked ceramic IC, assembled on a through-hole PWB. The component is an 8-pin DIP, T.I. P/N 5962-9452601QPA . The crack is located below the lead frame and radiates all the way around the device. Has anyone experienced this before? Please respond directly to me, as I cannot receive e-mails from Technet. Thanks in advance, Jim Marsico Senior Engineer Production Engineering EDO Corporation [log in to unmask] <mailto:[log in to unmask]> 631-630-5079 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------