Hi Technos,

I have a dynamite combination here. MEMS on PCBs that can be 0.093", 0.125" or even thicker. Currently the MEMS are in QFP package, but a castellated LCC is considered.

On top of it, the products are soon to be RoHS compliant.

It has been stated several times in this forum that leadless parts do not give reliable joints. But I have also seen castellated chips on aerospace boards. Are the castellated components more reliable than the plain leadless, where the joints are totally under the component?

Or otherwise stated, should I do my best to disqualify this package? Our application is maybe not high-rel, but just below, switching telecom devices.

Thanks,
Ioan

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