IPC announces the next International Conference on Flexible Circuits and Chip Scale Packaging to be held July 24-26 in Minneapolis, MN. Flexible circuitry and chip scale packaging (CSP) - a mix of seemingly unrelated topics, in fact are the missing pieces to the interconnection puzzle. Both of these topics are equally important in their effect on electronics manufacturing in this competitive marketplace. The blending of these technologies is well underway, with new designs, materials and applications appearing on a regular basis. Don't miss this opportunity to find out everything you need to know about flexible circuits, and chip scale packaging. While this international conference is highlighting the combination of flexible circuits and chip scale technologies, it is also recognized that the topics have critical and independent properties. Current developments with these areas will also address within this conference. Potential topics for presentations at the Flex and Chips Conference are: CSP Standards Progress Wafer Level CSP CSP Design CSP Die Attach CSP Solder Joint Reliability Flex Processing Innovations Flex Assembly Flex Market Trends Non-CSP Flex Applications Flex Test and Reliability Flex HDI for CSP Applications CSPs in Three Dimension Flex and CSP Materials Design for CSPs on Flex Flex with CSP Yields Flip Chip Development Flex and Lead Free Advanced Packaging The conference is offering presentation time slots between 30-45 minutes. Proposals are also solicited from individuals interested in teaching full-day tutorials (six hours) or half-day workshops (three hours) to a class of up to 30 persons on topics in the field. Examples include; reliability, process issues, rework, plating and surface finishes, design for lead-free, design for recycling etc. To submit an abstract or course proposal, please visit the Flex & Chips website at www.ipc.org/FlexNChips or e-mail your submission to [log in to unmask] Companies interested in information on the benefits associated with event sponsorship or exhibiting in our tabletop exhibit, please contact Tina Nerad at 847-597-2826 or e-mail at [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------