Years ago, there are attempt to use ribbon bond to replace the leads - direct chip attach (actually done on some of the high-rel parts). The performance is equal if not better. However, it is consider at the time slower than the QFP, cost more...With all the ultra fine pitch nowadays, I believe the direct bonding possibly provide much benefit compare to solder in both performance as well as cost/time... (faster bonder, more efficient ultrasonic transducer, etc.etc.). jk (my 2 cents) -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Leo Higgins Sent: Monday, April 03, 2006 12:02 PM To: [log in to unmask] Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads The thermosonic gold ball bond is made to the IC pad, and the second bond (wedge bond) is made to Ni/Au plated copper pads on typical BGA substrates. Aluminum could be, but is not generally used in such a package construction. Best regards, Leo Leo M. Higgins III, Ph.D. Vice President, Technical Support Operations ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 office phone 512-383-4593 mobile 512-423-2002 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric CHRISTISON Sent: Monday, April 03, 2006 3:25 AM To: [log in to unmask] Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads Ulrasonic welding is routinely done at a chip packaging level onto FR4 substrates. However we're talking 1 'thou diameter gold or aluminium wires. I believe the weld is made onto Ni/Ag plated pads. Regards, Eric Christison Mechanical Engineer Home, Personal, Communication Sector - Imaging Division STMicroelectronics 33 Pinkhill Edinburgh EH12 7BF Tel: +44 (0)131 336 6165 Fax: +44 (0)131 336 6001 > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke > Sent: Friday, March 31, 2006 6:38 PM > To: [log in to unmask] > Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads > > > Not tried that one myself, couple of things though, the > ultrasonic energy is going to have to have a sideways vector > to "scub away" oxides. I am not sure if the systems normally > used will do this or not. > > Second point is I recall that those ultrasonic welding > systems rely on a Z axis force, and I am not sure what this > will do to the shape/integrity of your FR4 PCB. > > TRY IT.............................. > > John > > John Burke > Senior Manager - Operations , Optichron [log in to unmask] > W: 510 249 5233 > M: 408 515 4992 > http://www.optichron.com > Profile: https://www.linkedin.com/e/fps/2665502/ > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Rodney Miller > Sent: Friday, March 31, 2006 6:32 AM > To: [log in to unmask] > Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads > > Anyone, anyone, Bueller, Bueller.... > > I think this will work, but I'm interested if anyone has > applied this to PCB before? > > -----Original Message----- > From: Rodney Miller [mailto:[log in to unmask]] > Sent: Wednesday, March 29, 2006 10:06 AM > To: 'TechNet ' > Subject: Ultrasonic Weld to PCB with Ni Pads > > > I have a component with Nickel lead, a battery, and > soldering/tinning it has been troublesome. > > I want to Ultrasonically Weld the leads to the PCB. Can I do > this with PCB FR4 Material. I was thinking if I cannot do it > through the PCB laminate, I might add a Via in pad and fill > the via with Nickel plate. > > The laminate is .030 and the finish option on the pads would > be Selective Immersion Ni, plated up to ???? 10um Maybe? > > Any input appreciated.... > > Rodney L. Miller > Tri-onics Inc > Highland / Shanghai > > Integrity and Solutions for Electronic Outsourcing > > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV > 1.8e To unsubscribe, send a message to [log in to unmask] with > following text in the BODY (NOT the subject field): SIGNOFF > Technet To temporarily halt or (re-start) delivery of Technet > send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------