The assembly side PWB manufacture has worked hard to quanify yield in terms of "defects per million opportunities - DPMO". While this is not actually a measure of scrap, this does even out differences between simple and complex assemblies Recently, the same group has started to try to quanify board fab in some similar terms to DPMO. Board fabrication is not so easy to quantify as it is harder to define an individual "opportunity". At Apex/Expo time, this group was collecting the defect codes from several board fabrication shops to try to get a feel for some metrics the committee could track. Anyone interested should contact IPC Committee 5-22G under Greg Hurst of BAE Systems or IPC Technical Staff LIason Jack Crawford, as a start. Denny Fritz MacDermid, Inc --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------