They have a document called ANGEN034B.pdf that talks about mounting considerations but I truly wondered about the survivability of the part after reading all the cautions... http://tinyurl.com/la2rw <http://tinyurl.com/la2rw> I wish there was a product out there I could look at that used this device so I had some feeling for the long term robustness of the assembly... Thanks for your take on the solder compliancy issue... I tend to agree. Perhaps different package is a better choice... I may recommend that on Monday. Best regards, Bill Brooks - KG6VVP PCB Design Engineer, C.I.D.+, C.I.I. Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 Datron World Communications, Inc. _______________________________________ San Diego Chapter of the IPC Designers Council Communications Officer, Web Manager <http://dcchapters.ipc.org/SanDiego/> http://dcchapters.ipc.org/SanDiego/ <http://pcbwizards.com> http://pcbwizards.com -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Friday, April 14, 2006 1:22 PM To: [log in to unmask]; [log in to unmask] Subject: Re: [TN] Mounting the Mitsubishi RD07MVS1 Surface Mount SLP package I wrote earlier: Hi Nill, Could not locate a data sheet on Mitsubishi MOSFET RD07MVS1 at the given website: http://www.mitsubishichips.com/Global/index.html. Found a reliability section "III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES". However, this section does not give you much confidence. For one, they use Norris-Landzberg [many Japanese companies use it for some unfathonable reason] even so it has been clearly shown [by IBM no less shortly after the initial Norris-Landzberg paper publication] that it does not work for solder, because it cannot account for dwell time effects. For another, they report results from testing to low T-extremes from -40 to -100C [!?], and show failures as early as 30 cycles [!?]. None of this gives me a warm, fuzzy feeling. Werner After seeing the data sheet at <http://tinyurl.com/fpgqa>, showing a ceramic device dissipating 50 W, being ~6X5 mm in size , and having no provision for solder attachment with any kind of compliancy, i not on have no 'warm, fuzzy feeling', but a lump of ice in my stomach. If you use this devicxe in an operating environment with some thermal cyclic loading, you are assured premature SJ-failures. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------