Hi all,

There are many thermal shock tests for via reliability, like AATC(air-to-
air thermal cycling), LLTS(liq-to-liq thermal shock), hot oil, IST, solder
float. How do I select appropriate test for my PCB? For the same product,
different test must have different test cycles to see the results. Do the
test cycles in various tests have relationship, like how many cycles in IST
are equivalent to how many cycles in AATC, LLTS, hot oil or solder float?
Did anyone do this study before? Or do any document refer to this?
Thanks!

Steven

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