While inspecting a board produced by mass manufacturing techniques, I
noticed the backside had been selectively soldered.  The areas where
through hole components are located appear to have been gasketed off (as
detected by observing the no-clean flux residue) by either the fluxing or
wave-like processing.  Any ideas as to how that was done?  Its clear that
the board wasn't wave soldered as there are open PTH's in the areas not
soldered.  A multi-nozzle solder fountain?

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