It's also easier to assemble, with less likelihood of shorting between the conductors (given you use the correct land pattern and spacing of vias etc.) Karl From: David Baldwin <[log in to unmask]> Reply-To: "(Designers Council Forum)" <[log in to unmask]>, David Baldwin <[log in to unmask]> To: [log in to unmask] Subject: [DC] BGA vs. QFP Date: Thu, 13 Apr 2006 14:54:39 -0700 Fellow Designers / Engineers: I have always believed this blanket statement: "A BGA will always provide superior performance to a QFP due to the powers / grounds being closer to the die, shorter wire bonding, and the absence of lead inductance" Is this a true statement or are there other considerations that I am missing? TIA. David Baldwin C.I.D.+ ______________________ Baldwin Tech Institute LLC 1736 S. Nevada Way Mesa AZ 85204 (480) 539-4400 www.Baldwin-Tech.com --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL) Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL) Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ---------------------------------------------------------------------------------