Kapton tape works well, just have to lay the TC wires so that they lay flat on the board before you tape them. If you force them down with the tape, the wire will spring up when the tape glue gets weak due to the heat. Other methods are high temp solder. The difference is about 2 to 3 degrees hotter with the solder. Some one in the forum did some experiments and came with a table of temp comparison for aluminum tape, kapton tape and high temp solder. Small TC wire can be used for under BGAs. Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeffrey Bush Sent: Tuesday, March 21, 2006 10:18 AM To: [log in to unmask] Subject: Re: [TN] thermocouple attachment We use a Polyimide Kapton tape. Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice - 802.257.4571 ext 21 Fax - 802.257.0011 <http://www.vtcircuits.com/> -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau Sent: Tuesday, March 21, 2006 9:56 AM To: [log in to unmask] Subject: [TN] thermocouple attachment Hello Techneter's, I am searching for a non-destructive technique for attaching thermocouples to a PCB for thermal profiling. I already know the technique with Aluminum tape proposed by the study made by KIC but I wanted a technique with some components installed on the PCB. Thank you Dominic --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------