No having a vendor spec or elemental analysis results how can one tell if you have a part with BeCu base alloy. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly Sent: Tuesday, March 14, 2006 1:51 PM To: [log in to unmask] Subject: Re: [TN] Soldering Issue with SMT connector Hi Werner, Is there somewhere I can go to review soldering issues on BeCu. We are having de-wetting issues on a connector which is matte tin over 1.27 um of nickel over the BeCu. The connector company says the parts meet spec but that does not help our soldering issue. Thanks. Steve Kelly -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: Tuesday, March 14, 2006 8:45 AM To: [log in to unmask] Subject: Re: [TN] Soldering Issue with SMT connector Hi Mike, The most likely reason is that there is no solder joint--it just looks like one. You did not say what the pin was made of, but from your description it may be a non-solderable metal like BeCu. The Au-plating only acts to let liquid solder cover [=wet in the surfactent sense], but not wet [=in the soldering sense of forming a metalurgical bond by disolving some of the pin metal]. In addition, butt joints have never worked well, even when the pin/lead metal is solderable. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------