I have some questions regarding immersion silver. IPC-4553 standard refers to a thin and thick deposit silver as if there are two different type of silver formulations. I've spoken to multiple domestic chemical suppliers of the silver process and they all offer the thick deposit version. One supplier stated that they can provide a thin deposit with their thick deposit version with no solderability issues. The IPC standard states not to do this. Question 1: Why can't a thick deposit silver version be used to deposit a thin deposit (3-5 uin)? Question 2: Who supplies a thin deposit silver? Question 3: Would the thin silver deposit perform better than a thick deposit silver when press fitting pins? Thank you, Eddie Rocha --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------