Hello again.

Question on IPC-610 (class 3) criteria.  For SMT solder joints, there appear
to be criteria set for TOE overhang, but not HEEL overhang.  Is this an
oversite or a purposeful omission?  Is there a limit on how much the heel of
an "L" shaped SMT lead can be off the pad lengthwise?  The obvious and
defined limit is "does not violate minimum electrical clearance", but does
anyone else have info on this criteria?

Thanks again,
Kevin Glidden


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