All

I've been assigned the task of determining if a supplier's current cleaning process is robust or if additional testing is required to be able to say that the product is clean enough to provide years of field use.  The board is a 2-sided Class 3 assembly (95% SMT) with one BGA and about 1500 other components. The assembly is soldered with a water soluble flux, it's cleaned in a batch cleaner with DI water, and is conformal coated.  The current manufacturer is using and Omega meter to verify the cleanliness of the board after cleaning.

My questions:

Is this process good enough to provide a reliable product in an aircraft application?
If not what guidance is available to determine what level of process qualification is needed to answer question #1?

Any help is really appreciated.

Don Vischulis

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