I do not show the Peters SD-2795 material listed in the NASA 1124 Pub, or ESA testing records as Peters is a European company. As a note, using the material by filling a via, then sealing with an over plate would not pose issues with CVCM or WVR as the material sealed in the via cannot experience weight loss from liberation of condensables. This seems not to be an issue in the via will application. This is a similar position to not requiring the testing of E-Glass as these reinforcements are composite to the epoxy system. Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice - 802.257.4571 ext 37 Fax - 802.257.0011 <http://www.vtcircuits.com/> -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Decker Sent: Friday, February 10, 2006 9:56 AM To: [log in to unmask] Subject: [TN] Via fillings question. OK, fillings may sound like a dental term, but I mean via plugging materials. :-) I'm looking for what materials I can use to plug a .010" via and meat NASA specs for out gassing, etc. I have some names so far, but no data on if they are approved for space apps. The names are so far: Peters fill (maybe this is a spec number, SD2795?) and is non-conductive? CB100, which I know is OK for space and conductive, but FAB would need a jack hammer to get it in a .010" hole so that's out. And last I have is San-IE, which I understand is non-conductive and supposed to be good in space, but San-IE what? For this project I don't need conductive but they will be under a BGA so it will need to be flat and covered with solder mask. I got that part covered, (no pun intended) but I just need to know what to call out on my drawing. Any help would be great. Later. Scott Decker AKA: Padmasterson Broad Reach Engineering CAE Ph. 480-377-0400 Ext. 34 FAX. 480-968-4597 Tempe, AZ. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------