Will not be at APEX to attend this meeting, however would like to be on this committee to support wherever I can. Rich Kraszewski Senior Advanced Manufacturing Engineer Kimball Electronics Group - KEDS 1015 W. 15th Street Auburn, Indiana 46706 [log in to unmask] 260.925.8719 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz Sent: Tuesday, February 07, 2006 10:19 AM To: [log in to unmask] Subject: [TN] Solder paste spread as a measure of solderablity Hello - We will be starting a new focus topic at the Thursday meeting of 5-23d Committee - Alternate Final Board Finishes Task Group. That meets at 3:15 on Thursday in Room 208A at Expo/Apex. We are looking to develop standard testing to measure solderablity of all board finishes, particularly after stress - storage, heat, humidity, etc. Our task group inputs to the J-003 Board Solderablity Standards Committee. Issues may come up including: A standard dot method for all finishes would be desireable, if possible. Is there a "standard solder paste"? that can be used Slump versus spread + hot slump method Possibly create an "index" for paste spread Evaluation of paste/finish combination Collect information on spread - possible round table in future. If you cannot attend, all comments on the possible test methodology would be appreciated. Dennis Fritz, MacDermid Committee Chairman - 5-23d Alt Finishes --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------