Will post the pictures when I get the cross sections... the image I see under the scope is EXACTLY the same as given in the IPC Criteria...the usefulness of that criteria starts and ends right there! Amol Kane M.S (Industrial Eng.) Process Engineer Harvard Custom Manufacturing 941 Route 38 Owego, NY 13827 Phone: (607) 687-7669 x349 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Friday, February 17, 2006 2:00 PM To: [log in to unmask] Subject: Re: [TN] Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/tear holes Hi Kane: Send some pictures to Stevo so he can place them on his wall, for all to see what the issue is, a picture is worth a thousand words. It might wake Steve up. He has been so quiet for so long. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Friday, February 17, 2006 1:19 PM To: [log in to unmask] Subject: Re: [TN] Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/tear holes Amol, I am not sure you are going to get a definitive answer to that given the IPC document shortfall. I suspect that over the next 6 months your e-mail may be the tip of a lead-free solder joint quality Ice Berg. John John Burke Senior Manager - Operations , Optichron [log in to unmask] W: 510 249 5233 M: 408 515 4992 http://www.optichron.com Profile: https://www.linkedin.com/e/fps/2665502/ -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349) Sent: Friday, February 17, 2006 10:08 AM To: [log in to unmask] Subject: [TN] Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/tear holes Dear Technetters, I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of SAC. IPC 610 Rev D 5.2.11 says that as long as the bottom of the tear is visible, and the tear does not contact any lead land or barrel wall, it is acceptable. My issue is that clearly IPC did not put any thought in this statement. For starters, what magnification should I use for inspection of this tear? The physical appearance of these tears is such that it is impossible to be able to see the bottom (they branch out inside in a zigzag manner, and are seldom just straight down). The location of these tears may prove conductive to crack propagation during thermal cycling. In view of this uncertainty, how do I pass these joints and ship the boards (Currently, I am in the process of x-sectioning the joints to determine the distribution and extent of these cracks in the solder to gather more info and pass/fail the boards based on it) Any thoughts everybody??? Regards, Amol Kane M.S (Industrial Eng.) Process Engineer Harvard Custom Manufacturing 941 Route 38 Owego, NY 13827 Phone: (607) 687-7669 x349 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------