Actually, embedded active components is becoming a rather hot topic, especially in Europe and Japan. Europe has research programs, focused at the Fraunhofer Institute in Berlin on both embedding active silicon devices in laminate - "Hiding Dies", and in flex - "Project Shift". In Japan, embedded active silicon has been forecast in the last two JISSO roadmaps. IPC is allowing place holders now in rigid board specifications for "Embedded Actives", in addition to significant standards work on "Embedded Passives". One intriguing thought is around the "Formed Component" and "Placed Component" inside the board. Mostly, we are familiar with "formed" embedded passives made by etching, printing or plating something on the innerlayer. However, much work is now going on to "place" very small discrete passive resistors and capacitors on innerlayers and then laminate or mold the rest of the PWB package around them. We think of "placing" active silicon die inside the package - flip chip, etc. However, there is the concept to "form" the IC by using organic semiconductor compounds to achieve a simple integrated circuit. Perhaps, RFID tags that use organic semiconductor compounds, screen printed or inkjetted in place, will be the first of the "embedded formed" active components. iNEMI has just formed a "printed electronics" committee to follow this activity. Perhaps this is wandering - please contact me off line if I can help further with these concepts. Denny Fritz MacDermid, Inc Chairman, Group 3 of JISSO International Committee - Embedded Components. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------