Hi 'dboudreau,' First, I like to refer you to IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave). Second, once you have properly profiled a component, the reflow oven recipe that gives you the needed reflow profile remains the same independent of the assembly. Third, you only need to profile for the coldest spot--the hottest spot will be somewhere on the PCB, but is only of interest if your PCB material cannot take the heat. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------