Hi 'dboudreau,'
First, I like to refer you to IPC-7530 Guidelines for Temperature Profiling
for Mass Soldering Processes (Reflow & Wave).
Second, once you have properly profiled a component, the reflow oven recipe
that gives you the needed reflow profile remains the same independent of the
assembly.
Third, you only need to profile for the coldest spot--the hottest spot will
be somewhere on the PCB, but is only of interest if your PCB material cannot
take the heat.

Werner

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