Looks like mousebites??? Well, we call them mousebites. There are a couple main causes, both of them cause poor electrolytic plating, the first being poor resist develop (for a variety of reasons we've determined) the second being poor agitation during electrolytic plating allowing bubbles to remain attached to copper edges. I say remain attached because it is not uncommon to have gas bubbles in solution, these will attach to trace edges (where resist and copper connect) and if not removed will act as a plating resist. Ragged edges down traces can be caused by resist image, develop, and poor tin (etch resist) plating, the type and severity of ragged appearance may provide more information in isolating a true location. Franklin -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Decker Sent: Thursday, February 23, 2006 1:34 PM To: [log in to unmask] Subject: [TN] Board etching question for you board shops out there. All you board gurus out there, I have a question for you. What are the reason(s) I see traces that look like a mouse has nibbled on the copper to etch it, as opposed to acid etching the copper? I'm looking at some boards that look like the resist was put on by a drunk with an old marker pen! The vias are not even round and the SMD lands have ragged edges also. This shop is off my list from here on out and going to be rebuilding some boards due to minimum trace problems too, but can anyone tell me what causes the ragged edges like that? I understand that specs are looking at averages, which means a high and low end of the spectrum. I think I know who put the low numbers into the pot. :-( Thanks for any info. Scott Decker AKA: Padmasterson Broad Reach Engineering CAE Ph. 480-377-0400 Ext. 34 FAX. 480-968-4597 Tempe, AZ. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------