Amol, In my opinion, "Zero Emissions" exists only in the minds of regulators and salesmen. What they are talking about is a positive air flow spray booth that sucks all VOCs into one air stream. That air stream becomes subsequently filtered, usually through a charcoal medium, such that any exhaust from the filter contains no VOCs or other regulated emissions. If your spray booth exhaust is not filtered, even if properly permitted, then it has emissions. Doug Pauls Rockwell Collins "Kane, Amol (349)" <akane@HARVARDGRP To .COM> [log in to unmask] Sent by: TechNet cc <[log in to unmask]> Subject [TN] Zero Emissions Spray Booth 02/16/2006 08:11 AM Please respond to TechNet E-Mail Forum <[log in to unmask]> ; Please respond to "Kane, Amol (349)" <akane@HARVARDGRP .COM> Dear TechNetters, A question was recently asked by a customer whether we have a "Zero Emissions Spray Booth" for conformal coating applications. We spray polyurethane, acrylic, epoxy and silicon coatings. We have an exhaust type spray booth to remove harmful vapors from the coating room. Can anyone shed some light on the Zero Emissions Spray Booth concept so that I can evaluate our existing infrastructure against the requirements and make upgrades if necessary. Thanks in advance, Amol Kane M.S (Industrial Eng.) Process Engineer Harvard Custom Manufacturing 941 Route 38 Owego, NY 13827 Phone: (607) 687-7669 x349 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Thursday, February 16, 2006 8:33 AM To: [log in to unmask] Subject: Re: [TN] BGA Reflow profile - Thermocouples Hi Dominic: It should not cost you much to find out what is the temperature of a board through reflow. The investment of buying a Mole or other similar device, that will allow you to record the profile of a board through an oven is only "once". If you are using eutectic solder and your coldest components sees 20 degrees over the melting point which is 203 C and you are not exceeding the highest temp that the most sensitive component may withstand, then you have a working profile, that simple. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau Sent: Wednesday, February 15, 2006 5:50 PM To: [log in to unmask] Subject: [TN] BGA Reflow profile - Thermocouples Hello Techneter's, I am working on a procedure to make the reflow profile of a PCB. What are the techniques to know where to attach the thermocouples on the "PCB"? I already know that it should be where we have the coldest and hottest spot but is it possible to know when we "must" test a BGA to have a better reflow profile. We are a little company so we don't have the money to test a BGA each time we have one on a PCB. Thank you --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------