Ivan, The "Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a Molten Tin-Lead Solder" came from Wally G. Bader's article of the same title published in the December 1969 Welding Journal. Regards, George George M. Wenger Reliability / FMA Engineer Base Station and Subsystems Group Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ivanoe Pedruzzi Sent: Monday, January 16, 2006 5:38 AM To: [log in to unmask] Subject: [TN] Dissolution rates and solder paste selection Back on dissolution metals in molten solder, I remember reading on an e-mail the following dissolution rates: Dissolution rates Au = 117.9 u"/sec. Ag = 43.6u"/sec. Cu = 4.1 u"/sec. Pd = 1.4 u"/sec. Ni = 0.05u"/sec. Pt = 0.01 u"/sec. At which temperature of the molten solder these dissolution rates are applicable? If I use those numbers to set up the TIME ABOVE LIQUID temperature profile in a reflow oven, I'm not doing anything but the right thing, am I ? I also remember reading something about flux in the solder paste that should be able to withstand that change (either longer time, or higher temp, or both). Upon your experience, is that practical? I don't remember any solder paste representative talking about "...this paste for this plating, that paste for that plating...". Do you? Thanks, Ivan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. If you have received it in error, please notify the sender immediately and delete the original. Any unauthorized use of this email is prohibited. ------------------------------------------------------------------------------------------------ [mf2] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------