Victor, ENEPIG has been around for a long time. Its popularity has never taken off because of the high cost of Pd at the time it was launched. There was always a question about the solder joint reliability of this finish when used with eutectic solder. Pd does not form intermetallics with the Pb. Today Pd price is well below gold and it makes sense to re-evaluate the viability of the finish. Unlike ENIG where an immersion gold is deposited over the Ni, Palladium is deposited chemically (electroless, not immersion), this precludes any chance of Ni corrosion. The presence of Pd in the solder joint interface prevents the excessive propagation of the thickness of the IMC, and gives rise to a very superior solder joint with SAC3o5 alloy The recommended thicknesses are 120 -240 uins of Ni, 5-8 uins of Pd and 1-2 uins of gold. Best regards George Milad [log in to unmask] National Accounts Manager for Technology Uyemura International Corporation Technical Center 240 Town LIne Rd Southington CT 06489 (516) 901 3874 (mobile) (860) 793-4011 (office) (860) 793-4020 (fax) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------