Hi All, I have some questions concerning the baking of moisture sensitive components. Are there any general guidelines you follow regarding the amount of time/temperature required to properly bake components or PCB assemblies prior to component assembly or rework? I've seen articles speak of 12, 24 or 48 hour bakes at 125 C. Also, can anyone recommend a small table top type oven to perform the baking with? I've heard some people use a regular old toaster oven with success, but I might be concerned about the temperature control capability of such an oven. I work in a small PCB prototype environment where the boards may be up to 14" x 10" in size. I might need to prep 1 or 2 PCB assemblies along with maybe 6 BGA's (40mm x 40mm) at a time with the oven. I'd greatly appreciate any recommendations or additional comments on the subject. Regards, Bob Walker [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------