Hi Greg, IPC LF Listservers, <=== <I am wondering if anyone out there is re-balling lead-free BGA's with tin-lead and would be willing share their experiences. I see a few vendors offer this service. I don't doubt that it's feasible to do this but I wonder how reliable the BGA interconnects would be after the re-balling process. Can re-balling be considered an interim solution to the problem of soldering a LF BGA in a tin-lead process?> <=== One company I can think of ordered several years of supply of SnPb BGA's before the conversion to LF. If your electronic/electrical designer strongly needs to use this particular component, and the SnPb industry volume for this BGA stays small, this reballing could become a permanent process. ByTheWay, a good question considering potential military, etc applications. Reballing as a standard long term process might add some reliability risks. Yours in Engineering, Dave YiEngr, MA/NY DDave -------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Leadfree To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL) Search previous postings at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -------------------------------------------------------------------------------