We start with a profile that emulates the reflow profile- ramp rates about 1 C/sec, peak temp 205 C with a time above reflow of 45-60sec. In cases of large OMPAC packages we cut back on the soak section of the profile to help reduce dimensional warpage on some packages (we getting either shorts or opens at the corners of the packages) ________________________________ From: TechNet [mailto:[log in to unmask]] On Behalf Of Alan Kreplick Sent: Wednesday, December 07, 2005 4:35 PM To: [log in to unmask] Subject: [TN] BGA Rework Max temp & time above Liquidus Hello Technetters: Quick survey/question: For BGA removal/replacement (SN63), what are people using for max solder joint temperature and it's associated time above liquidus. Copying the reflow profile guidelines? I've previously went about 5-10C less than the reflow profile guidelines to prevent overheating of the part/case and to attempt to prevent any BGA's on the bottom-side from re-reflowing, but now I'm second guessing myself. Thanks in advance. Al Kreplick Sr. Manufacturing Engineer Land Combat/Precision Strike/Air to Air 978.470.9931 978.470.4307 fax 978-245-1702 pager [log in to unmask] <mailto:[log in to unmask]> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------