Thank you very much. I contacted our local Speeline/ Electrovert rep. and they did not mention this process whatsoever - interesting eh? It is nice to know that there is this forum in which there is much knowledge to be learned.
 
Thanks again everyone.
 
CAS

	-----Original Message----- 
	From: TechNet on behalf of Cheryl Tulkoff 
	Sent: Mon 12/12/2005 8:16 AM 
	To: [log in to unmask] 
	Cc: 
	Subject: Re: [TN] Preparing Solder Pot for Lead Free Processing
	
	

	Chris -
	
	We cleaned an existing tin/lead cast iron solder pot (Electrovert) and
	converted it to lead free with excellent results - verified by analytical
	reports for various contamination levels.
	
	We simply drained the pot, gently scrubbed and vacuumed, and replaced all
	the internal parts (pot drain valve, sumps/pumps/baffles). We also
	installed new finger brushes, conveyor chains, and fingers. The preheaters
	and housing areas were all vacuumed and wiped down as well.
	
	Tin "wash" procedure have been talked about but they are a pricey way to
	go. They basically involve using an initial sacrificial 100% tin bath and
	redrain (recycle) before final filling with your lead free alloy.
	
	The procedure from Speedline is cut and pasted here:
	SCOPE:  LEAD FREE UPGRADE PROCEDURE
	                                    ELECTRA / VECTRA
	
	      METHOD:
	
	
	      1.    Remove all nozzles, flowducts, pumps and all other components
	that are in the pot. Use
	                         protective equipment while performing this task.
	
	      2.    Leave heaters on while draining solder.
	
	      3.    Drain solder from the pot and scrape the sides and bottom to
	remove any solder residue and
	
	                         dross.
	
	            4.         This procedure will provide a contamination level
	well below the required specification as
	
	                      long as the pot was cleaned properly.
	
	         5. Change the solder pot configuration to lead-free. See the
	   Software Configuration Manual.
	
	      6.    Fill pot with lead-free solder and allow the solder to melt and
	reach the setpoint temperature.
	
	      7.    Once solder has reach the setpoint temperature de-dross the
	pot.
	
	            8.          Install the new lead-free flowducts, nozzles, pumps
	and other parts in the lead-free upgrade.
	
	                        The existing belts and pulleys and covers will need
	to be used. Use protective equipment when
	
	                        performing this task.
	
	      9.    Using the nozzle setup tools, level nozzles and make sure the
	pumps are seated.
	
	      10.       Have solder analyzed to ensure lead levels are below
	specification.
	
	Thanks,
	Cheryl Tulkoff
	Senior Reliability Engineer
	Phone:(512) 683-8586
	Fax: (512) 683-8847
	National Instruments
	11500 N. Mopac Expressway
	Building A
	Austin, TX 78759-3504
	
	
	
	
	
	             "Schaefer, Chris"
	             <Chris.Schaefer@S
	             UNTRONCORP.COM>                                            To
	             Sent by: TechNet          [log in to unmask]
	             <[log in to unmask]>                                          cc
	
	                                                                   Subject
	             12/12/2005 07:58          Re: [TN] Preparing Solder Pot for
	             AM                        Lead Free Processing
	
	
	             Please respond to
	              TechNet E-Mail
	                   Forum
	             <[log in to unmask]>
	             ; Please respond
	                    to
	             "Schaefer, Chris"
	             <Chris.Schaefer@S
	              UNTRONCORP.COM>
	
	
	
	
	
	
	Thank you all.
	
	So should I do one of the following:
	
	- Replace the solder pot altogether (the safest method, but most expensive)
	- Clean the existing cast iron pot as best possible then fill with Pb Free
	solder (higher risk, but less expensive)
	
	If anyone has cleaned their existing cast iron  solder pot, then how did
	you do it exactly? Is there a proposed method for doing this somewhere out
	there?
	
	Any suggestions would be very helpful.
	
	CAS
	
	             -----Original Message-----
	             From: [log in to unmask] [mailto:[log in to unmask]]
	             Sent: Fri 12/9/2005 11:10 AM
	             To: Schaefer, Chris; [log in to unmask]
	             Cc:
	             Subject: Re: [TN] Preparing Solder Pot for Lead Free
	Processing
	
	
	             Hi Chris,
	             Pb left in the old 'pot' may not be your biggest problem--look
	at these pics.
	
	
	
	
	             Regards,
	             Werner Engelmaier
	             Engelmaier Associates, L.C.
	             Electronic Packaging, Interconnection and Reliability
	Consulting
	             7 Jasmine Run
	             Ormond Beach, FL 32174 USA
	             Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
	             E-mail: [log in to unmask], Website: www.engelmaier.com
	
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