Hello Technetters:

Quick survey/question: For BGA removal/replacement (SN63), what are people using for max solder joint temperature and it's associated time above liquidus.

Copying the reflow profile guidelines?  I've previously went about 5-10C less than the reflow profile guidelines to prevent overheating of the part/case and to attempt to prevent any BGA's on the bottom-side from re-reflowing, but now I'm second guessing myself.

Thanks in advance.

	Al Kreplick Sr. Manufacturing Engineer Land Combat/Precision Strike/Air to Air 978.470.9931 978.470.4307 fax 978-245-1702 pager [log in to unmask]